JPH0612622Y2 - リードチップからなる外部接続端子および当該外部接続端子を備えた混成集積回路装置 - Google Patents
リードチップからなる外部接続端子および当該外部接続端子を備えた混成集積回路装置Info
- Publication number
- JPH0612622Y2 JPH0612622Y2 JP1990110255U JP11025590U JPH0612622Y2 JP H0612622 Y2 JPH0612622 Y2 JP H0612622Y2 JP 1990110255 U JP1990110255 U JP 1990110255U JP 11025590 U JP11025590 U JP 11025590U JP H0612622 Y2 JPH0612622 Y2 JP H0612622Y2
- Authority
- JP
- Japan
- Prior art keywords
- external connection
- terminal
- integrated circuit
- connection terminal
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 125000006850 spacer group Chemical group 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 238000007639 printing Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 235000019640 taste Nutrition 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990110255U JPH0612622Y2 (ja) | 1990-10-23 | 1990-10-23 | リードチップからなる外部接続端子および当該外部接続端子を備えた混成集積回路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990110255U JPH0612622Y2 (ja) | 1990-10-23 | 1990-10-23 | リードチップからなる外部接続端子および当該外部接続端子を備えた混成集積回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0466780U JPH0466780U (en]) | 1992-06-12 |
JPH0612622Y2 true JPH0612622Y2 (ja) | 1994-03-30 |
Family
ID=31857563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990110255U Expired - Lifetime JPH0612622Y2 (ja) | 1990-10-23 | 1990-10-23 | リードチップからなる外部接続端子および当該外部接続端子を備えた混成集積回路装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0612622Y2 (en]) |
-
1990
- 1990-10-23 JP JP1990110255U patent/JPH0612622Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0466780U (en]) | 1992-06-12 |
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